How do you calculate sputter yield?
It is found that the elemental and compound data expressed as the yields, Y, of atoms sputtered per primary ion may all be described by a simple universal equation: Y/n = (E/An)q/[1 + (E/An)q−1] where the parameters A and q are established by fitting.
What is the sputter yield?
Sputter yield (S) is an important parameter defined as the mean number of atoms removed from the target surface per incident ion.
What should be the incident angle from normal for maximum sputter yield?
60°- 70°
The maximum sputter yield occurs when the incident angle is 60°- 70° from normal.
What is sputtering yield What are the main factors that control sputtering yield?
The sputter yield depends on several things: the angle at which ions collide with the surface of the material, how much energy they strike it with, their masses, the masses of the target atoms, and the target’s surface binding energy.
How is sputtering done?
Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These collisions cause an electrostatic repulsion which ‘knock off’ electrons from the sputtering gas atoms, causing ionization.
What is the sputter yield Mcq?
sputtering yield refers to atoms/ion. If an ion of certain energy is hitting the target, and the target atoms are sputtering out, then how many target atoms are ejected out w.r.t to the momentum transfer of a single ion, this is known as sputtering yield.
What is a sputtering system?
Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. After base pressure has been reached, sputtering gas which comprises the plasma is flowed into the chamber and the total pressure is regulated – typically in the milliTorr range – using a pressure control system.
Why is argon used for sputtering?
Inert gases, specfically argon, are usually employed as the sputtering gas because they tend not to react with the target material or combine with any process gases and because they produce higher sputtering and deposition rates due to their high molecular weight.
Which is an important parameter of the sputter yield?
Sputter yield (S) is an important parameter defined as the mean number of atoms removed from the target surface per incident ion. From: Sputtering Materials for VLSI and Thin Film Devices, 2014
How are sputter yields measured in a discharge tube?
At first, sputter yields were measured in the cold cathode discharge tube.12,13 But these measurements did not offer reliable data because the incident ions and sputtered atoms frequently collide with discharge gas molecules in the cold cathode discharge tube.
How is sputter yield related to radiation damage?
Sputter yield data have been extensively accumulated in relation to gas discharges, sputter deposition, etching, surface analysis, and radiation damage.
Which is larger the sputter yield or the PIXE?
Recent PIXE techniques suggest that the sputter yield of Cr, S (Cr), measured by Wehner, is larger than S (Cr) measured by the PIXE. Sartwell has measured that S (Cr)=0.93 atoms/ion at 1.0 keV Ar + bombardment measured by PIXE. 2 Wehner has reported a value of S (Cr)=1.18 atoms/ion at 500 eV.