What is chemical mechanical process?
Chemical mechanical processing (CMP) is a process that ensures regions of semiconductor components are level, or planarized. CMP combines physical grinding and chemical etching to smooth the surfaces of semiconductors.
What is CMP equipment?
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
How are CMP pads made?
Performance in the CMP Process The polishing pad, which is made up of a matrix of cast polyurethane foam with filler material to control hardness or polyurethane impregnated belts [1], considerably and directly affects the wafer to wafer non uniformity (WTWNU) and the within wafer non uniformity (WIWNU).
What does CMP stand for in manufacturing?
Continuous Mill Plate (steel manufacturing) CMP.
Why do we need planarization?
Planarization is a flattening or smoothing out of the wafer surface topography by 1) filling in the deep “trench” areas; 2) etching the top surface of an etched structure; 3) filling in via holes; or 4) some combination of these. Planarization modeling is used to map optimal parameters for layer thickness.
What does CMP mean in retail?
The term CMP, when used in trading stocks, stands for current market price. Also known as current market value, this refers to the rough price at which shares currently are trading in the market.
What does VMP mean?
VMP
| Acronym | Definition |
|---|---|
| VMP | Visitor Management Plan (various organizations) |
| VMP | Veterans Memorial Park |
| VMP | Veterinary Medicinal Product |
| VMP | Vehicle Movement Plan (Australia) |
How is selective material removal achieved in mechanical planarization?
The selective material removal is achieved by using chemical reaction and mechanical abrasion with slurries containing unique chemical formulations and large numbers of abrasive particles. During polishing, chemical reaction products and mechanical wear debris are generated.
Why was chemical mechanical planarization used in photolithography?
Chemical mechanical polishing/planarization (CMP) was developed in the late 1980s in order to overcome problems with multi-layer metallization. The increasing topography as a result of stacked metal lines led to depth-of-focus problems during photolithography and to reliability problems caused by metal line thinning.
How are wafers cleaned after chemical mechanical planarization?
Cleaning of wafers after chemical mechanical planarization (CMP) has become an important part of the BEOL processes. Cleaning after CMP of oxide, tungsten and copper films presents many challenges.
How is post CMP cleaning used in chemical mechanical planarization?
Post-CMP cleaning plays a critical role in meeting stringent CMP defect and device reliability/yield requirement. CMP is used to pattern the Cu and barrier layer after metallization of the dual damascene structure. The wafers are placed face-down on a rotating pad on which the slurry is dispensed.